BERGQUIST® SIL PAD TSP Q2000

Žinoma kaip Q-Pad® 3

Savybės ir privalumai

Thermally conductive, fiberglass-reinforced, silicone insulator pad suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.
BERGQUIST® SIL PAD TSP Q2000 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating and air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables BERGQUIST SIL PAD TSP Q2000 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
Aprašymas

Techniniai duomenys

Darbinė temperatūra -60.0 - 180.0 °C
Liepsnos įvertinimas V-0
Nešančiosios medžiagos tipas Stiklo pluoštas
Spalva Juoda
Šilumos laidumas 0.2 W/mK