Low-Stress Die Attach for High Reliability Smart Cards

Henkel has developed a new die attach formulation designed for exceptionally fast processing and compatibility with the most widely used encapsulants in the market.

Author: Simon Turvey

Contact Us

Please fill out the form below and we'll respond shortly.

There are some errors, please correct them below
What would you like to request?
This field is required
This field is required
This field is required
This field is required
This field is required
This field is invalid