Across market sectors, semiconductor technology is the foundation for delivering what industries and consumers want:  robust function, smaller size, unfailing reliability and lower cost.  Whether it’s edge and cloud computing, automotive electronics, smart home systems or mobile devices, advances in semiconductor packaging are delivering on these objectives. 

As the demands on semiconductor devices intensify year over year, advanced packaging techniques are providing the form factor and processing power required for today’s digitized world.  System level integration, higher functionality, faster performance,  and relentless miniaturization characterize the electronics market.  Achieving these ambitions requires not only design creativity, but material ingenuity.  Henkel has set the benchmark for advanced packaging materials development with continued product innovations in underfills, encapsulants, lid and stiffener attach adhesives and package-level EMI solutions for applications including flip chip, wafer-level packaging and memory 3D TSV.  

Underfills

Higher I/O counts, package integration and tighter bump pitches are dictating the use of flip-chip technology to enable advanced package designs.   

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EMI

The convergence of advanced RF communication capability, miniaturization and package-level integration underscore the requirement for novel approaches to EMI shielding.  

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Wafer Level Encapsulation

Wafer-level packaging applications have seen explosive growth as they continue to be key enablers of innovation in mobility products, consumer electronics, data processing and IoT applications, among others.

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Lid and Stiffener Attach

 Advanced flip-chip technology and heterogeneous integration are key enablers of high-performance computing, driving new levels of processing power for desktops, data center servers, autonomous driving systems.

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Resources for Advanced Semiconductor Packaging

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