BERGQUIST® GAP FILLER TGF 3600

Known as Gap Filler 3500S35

Features and Benefits

A highly thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Excellent low and high temperature, mechanical and chemical stability.
BERGQUIST® GAP FILLER TGF 3600 is a 3.6 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It exhibits ultra-high thermal performance and superior softness. This product has low modulus to help relieve CTE stresses in thermal cycling and provide excellent vertical gap stability. It can be used for fragile and low stress applications in various fields. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
  • Thermal conductivity: 3.6 W/m-K
  • Ultra low modulus
  • Ultra conforming
  • Easily dispensable
  • UL94 V-0 compliance
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Technical Information

Cure type Heat cure
Flame rating V-0
Operating temperature -60.0 - 200.0 °C
Thermal conductivity 3.6 W/mK
Mixed
Color, Mixed Blue
Resin
Color, Resin White
Hardener
Color, Hardener Blue

Frequently Asked Questions