LOCTITE® ABLESTIK QMI529HT

Features and Benefits

LOCTITE ABLESTIK QMI529HT, BMI/Acrylate, Die attach
LOCTITE® ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater.
  • Electrically conductive
  • Thermally conductive
  • Void-free bondline
  • Hydrophobic
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 53.0 ppm/°C
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 20.0 ppm
Extractable ionic content, Fluoride (F-) 20.0 ppm
Extractable ionic content, Potassium (K+) 20.0 ppm
Extractable ionic content, Sodium (Na+) 20.0 ppm
Hot die shear strength, @ 245.0 °C 7.62 x 7.62 mm die on Ag/Cu leadframe 21.0 kg-f
Key characteristics Conductivity: electrically conductive, Conductivity: thermally conductive
Number of components 1 part
Physical form Paste
RT die shear strength, 7.62 x 7.62 mm die on Ag/Cu leadframe 57.0 kg-f
Recommended for use with LeadFrame: gold, LeadFrame: silver
Tensile modulus, @ 25.0 °C 3300.0 N/mm² (478500.0 psi )
Thixotropic index 4.8