High Power Density Applications Enabled by New Thermal Interface Material

COVID-19 Update

Henkel corporate provides some information regarding Henkel and COVID-19.

Read More

Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology, created for the increasing requirement for lower-stress materials for next-generation high power density devices.

Author: Danny Leong