BERGQUIST® GAP PAD® TGP 3004SF
Conosciuto come Gap Pad® 3004SF
Caratteristiche e vantaggi
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone-free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. It has no silicone content, so is ideal for silicone sensitive applications.
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Informazioni tecniche
| Classe di infiammabilità | V-0 |
| Colore | Grigio chiaro |
| Conducibilità termica | 3.0 W/mK |
| Densità, Maximum Final | 3.2 g/cm³ |
| Durezza shore, Thirty second delay value, ASTM D2240 Gomma bulk @ 23.0 °C Shore 00 | 70.0 |
| Spessore standard | 0.254 - 3.715 mm |
| Temperatura di esercizio | -40.0 - 125.0 °C |
| Tipo carrier | Film in PET da 0,25 mil |
BERGQUIST® GAP PAD® TGP 3004SF
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.