BERGQUIST® GAP PAD® TGP 1500
Conosciuto come Gap Pad® 1500
Caratteristiche e vantaggi
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Informazioni tecniche
| Colore | Nero |
| Conducibilità termica | 1.5 W/mK |
| Modulo di Young, ASTM D575 | 310.0 KPa (45.0 psi ) |
| Spessore standard | 0.508 - 5.08 mm |
| Temperatura di esercizio | -60.0 - 200.0 °C |
BERGQUIST® GAP PAD® TGP 1500
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.