arrow_down arrow_left arrow_right arrow_up burger_menu ic-checkmark close contact download edit filter Icon-GetDirections location_selector Shape Icon-GoToWebsite search neu social_facebook social_google_plus social_instagram social_linkedin social_snapchat social_twitter social_vk social_wechat social_xing social_youtube

High Power Density Applications Enabled by New Thermal Interface Material

Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology, created for the increasing requirement for lower-stress materials for next-generation high power density devices.

Author: Danny Leong