LOCTITE® ABLESTIK ATB 125

Known as EASY STACK ATB-125-12

Features and Benefits

LOCTITE® ABLESTIK ATB 125 adhesive film is formulated for use in wafer lamination proceses. It combines process ease with the proven reliability of a hybrid chemistry-based die attach material.
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Technical Information

Adhesive film thickness 25.0 µm
Carrier film thickness 85.0 µm
Dicing tape diameter 12.0
Extractable ionic content, Chloride (CI-) 10.0 ppm
Extractable ionic content, Potassium (K+) 2.0 ppm
Extractable ionic content, Sodium (Na+) 8.0 ppm
Hot die shear strength 2.0 kg-f
RT die shear strength 15.0 kg-f
Tensile modulus, DMTA @ 250.0 °C 8.6 N/mm² (1250.0 psi )
Wafer diameter 12.0
Weight loss, @ 300.0 °C 1.0 %