BERGQUIST® GAP PAD TGP 3004SF

Known as Gap Pad® 3004SF

Features and Benefits

A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. This product has no silicone content and is therefore ideal for silicone sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Technical Information

Carrier type 0.25 mil PET Film
Color Light Gray
Density, Maximum Final 3.2 g/cm³
Flame rating V-0
Operating temperature -40.0 - 125.0 °C
Shore hardness, Thirty second delay value, ASTM D2240 Bulk Rubber @ 23.0 °C Shore 00 70.0
Standard thickness 0.254 - 3.715 mm
Thermal conductivity 3.0 W/mK