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Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect

In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling.

Author: Mark Currie, Ph.D; Neil Poole, Ph.D; Wanda O’Hara and Doug Dixon