BERGQUIST® LIQUI FORM TLF 6000HG
Značajke i prednosti
One-part, gray, silicone-based, fully cured thermal interface gel specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.
Award-winning BERGQUIST® LIQUI FORM TLF 6000HG is a thermally conductive, dispensable, highly conformable thermal interface gel that provides electronic component thermal management capability within remote antennas and 5G base stations. It is ideal for filling larger gaps that measure up to 3.0mm, delivering robust vertical gap stability. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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| Jakost plamena | V-0 |
| Radna temperatura | -60.0 - 200.0 °C |
| Toplinska vodljivost | 6.0 W/mK |
| Vijek trajanja, @ 25.0 | 365.0 dan |
BERGQUIST® LIQUI FORM TLF 6000HG
One-part, gray, silicone-based, fully cured thermal interface gel specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.