Customer Challenge

• The customer’s new design for a DC-DC power converter required a more efficient, high-volume solution for the application of thermal management materials. 
  
  
• For previous-generation designs, silicone pads were applied in several locations between the DC-DC converter’s printed circuit board and metal housing. Use of the pads presented several inventory and production-related issues, including:
  
  - Operator handling difficulty of the thin sheets
  - Manual and time-consuming application process
  - Sourcing of silicone pads in many different sizes and thicknesses
  
  
• Any new material solution had to provide similar or better thermal performance as that achieved with the silicone pads. 

Customer Challenges

• A new electronic control unit (ECU) design incorporates a large processor IC that requires excellent heat dissipation for optimized function. 
• The system is sensitive and outgassing minimization is necessary to avoid interference with other components.

Customer Challenges

• A new Programmable Logic Controller (PLC) design required a robust thermal management solution with no outgassing risk.
• As the system can be used in a variety of machines and production environments, the thermal materials must be conducive to many conditions.
• The customer requested the use of a silicone-free thermal solution to avoid silicone contamination, but wanted to maintain the stress control and heat benefits generally consistent with silicone-based thermal interface materials (TIMs) based thermal interface materials (TIMs). 

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