BERGQUIST® GAP PAD TGP HC3000

Known as Gap Pad® HC 3.0

Features and Benefits

Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
  • Thermal conductivity: 3.0 W/m-K (ASTM D5470)
  • High-compliance, low compression stress
  • Fiberglass-reinforced for shear and tear resistance
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Technical Information

Carrier type Fiberglass
Color Blue
Flame rating V-0
Operating temperature -60.0 - 200.0 °C
Standard thickness 0.508 - 3.175 mm
Thermal conductivity 3.0 W/mK
Young's modulus, ASTM D575 110.0 KPa (16.0 psi )