Customizable Silicone Materials for MEMS and Semiconductor Packages Micro Electro Mechanical Systems (MEMS) are driving the merger of various sensing capabilities into a single device, and are used in many different applications. Largely employed in the handheld sector which is driving MEMS growth, smartphones today can contain as many as ten to twelve — or even more — MEMS devices, with this number projected to grow in the coming years. Manufacturing MEMS devices is a balancing act, as MEMS die are very sensitive and fragile. Too much stress from die bonding may crack the die and, if the bonding adhesive’s modulus is high, the die can bend due to stress. This flex can cause the moving parts of the MEMS to go out of calibration. To accommodate these stress and modulus challenges, Henkel has developed a silicone material technology for MEMS devices which offers a low and stable modulus across the reflow profile. The material has no bleed and higher adhesion strength than previous-generation adhesives and is completely customizable. The unique... Read More
Electrically Conductive Adhesives for Building Reliable Connections Automotive electronics' technology continues to find new applications all around the vehicle. Electronic control units are often assembled using Electrically Conductive Adhesives (ECAs), where components are attached to noble metallized ceramic or HDI boards. The major limitation of ECAs has been their instability on common electronic metals, such as tin, which requires the use of expensive noble finished metallizations. Henkel however, has developed a product that enables stable performance with 100 percent tin-terminated components under several challenging test conditions. Henkel's ECAs provide the benefit of lower processing temperatures compared to solder pastes. This enables bonding of temperature sensitive components to temperature sensitive substrates without damaging them. Author: Cindy Doumen Read More