BERGQUIST® GAP PAD TGP HC3000

Tuntud kui Gap Pad® HC 3.0

Omadused ja eelised

Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
Lugege rohkem

Tehniline teave

Arvestuslik leegikindlus V-0
Kanduri tüüp Klaaskiud
Soojusjuhtivus 3.0 W/mK
Standardpaksus 0.508 - 3.175 mm
Töötemperatuur -60.0 - 200.0 °C
Värvus Sinine
Youngi moodul, ASTM D575 110.0 KPa (16.0 psi )