LOCTITE® ECCOBOND UF 3808

Features and Benefits

LOCTITE ECCOBOND UF 3808, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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Technical Information

Coefficient of thermal expansion (CTE), Above Tg 171.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 55.0 ppm/°C
Cure schedule, @ 130.0 °C 8.0 min.
Glass transition temperature (Tg) 113.0 °C
Viscosity, Physica Spindle CP50-1, Shear Rate 1,000 s⁻¹ 360.0 mPa·s (cP)