Features and Benefits

BERGQUIST GAP PAD TGP 10000ULM, Thermal interface material, Gap pad, Thermal performance at low pressures
BERGQUIST® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. BERGQUIST GAP PAD TGP 10000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
  • Thermal Conductivity: 10 W/m-K
  • Ultra low modulus
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Technical Information

Color Grey
Technology Silicone
Thermal Conductivity 10 W/mK
Usage Temperature -60 - 200 °C