BERGQUIST® LIQUI BOND TLB SA2005RT
Features and Benefits
2-part silicone adhesive for high performance automotive electronics applications where thermal conductivity is needed.
BERGQUIST® LIQUI BOND TLB SA2005RT functions as a thermal interface material as well as a structural adhesive. It is ideal for demanding automotive applications like electronics, power supplies pumps, and automotive modules. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
- Thermal conductivity: 2.0 W/m-K (ASTM D5470)
- High bond strength
- Adaptable cure mechanism
- High elongation modulus
Documents and Downloads
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Additional Documents
Technical Information
| Cure type | Heat cure, Room temperature (ambient) cure |
| Operating temperature | -60.0 - 180.0 °C |
| Shelf life | 6.0 mon. |
| Storage temperature | 25.0 °C |
| Thermal conductivity | 2.0 W/mK |
BERGQUIST® LIQUI BOND TLB SA2005RT
2-part silicone adhesive for high performance automotive electronics applications where thermal conductivity is needed.