LOCTITE® ABLESTIK CE 3920
Known as CE-3920
Features and Benefits
This 1-part, low-temperature curing, electrically conductive die-attach adhesive is designed for SMD interconnect formation and stencil/screen printing.
LOCTITE® ABLESTIK CE 3920 is a silver, electrically conductive die-attach adhesive for dispense or printing applications and surface-mount technology (SMT) assembly processes. It’s a low-viscosity, low-CTE and Pb-free alternative to solder with a long work life for minimal product waste and clean-up time. LOCTITE® ABLESTIK CE 3920 is formulated with an epoxy-based resin, cures fast when exposed to heat and doesn’t require any post-cure.
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Technical Information
| Cure schedule, @ 150.0 °C | 5.0 min. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Storage temperature | -40.0 °C |
| Thixotropic index | 5.7 |
| Viscosity, cone & plate, Angle 3° Speed 5 rpm | 26100.0 mPa·s (cP) |
| Volume resistivity, @ 25.0 °C sample cured 5 min. @150 °C | 0.0003 Ohm cm |
LOCTITE® ABLESTIK CE 3920
This 1-part, low-temperature curing, electrically conductive die-attach adhesive is designed for SMD interconnect formation and stencil/screen printing.