Epoxy Flux Technology

A new material system — called epoxy flux — is enabling many applications in both semiconductor packaging and printed circuit board (PCB) assembly, as well as some of the emerging device configurations such as package-on-package (POP). Designed to offer process efficiency, epoxy flux underfills deliver a fluxing component that facilitates solder joint formation as well as an epoxy system that offers added device protection by encapsulating individual bumps.

Authors: Bruce Chan, Qing Ji, Mark Currie, Nil Poole, C.T. Tu