BERGQUIST® GAP PAD TGP 3004SF
Bekannt als Gap Pad® 3004SF
Merkmale und Vorteile
A high performance, thermally conductive, silicone-free gap pad filler with a thermal conductivity rating of 3.0 W/m-K for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. This product has no silicone content and is therefore ideal for silicone sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Technische Informationen
Betriebstemperatur | -40.0 - 125.0 °C |
Dichte, Maximum Final | 3.2 g/cm³ |
Entflammbarkeit | V-0 |
Farbe | Hellgrau |
Shore-Härte, Thirty second delay value, ASTM D2240 Bulk-Gummi @ 23.0 °C Shore 00 | 70.0 |
Standarddicke | 0.254 - 3.715 mm |
Träger | 0,25 mil PET-Folie |
Wärmeleitfähigkeit | 3.0 W/mK |