LOCTITE® ABLESTIK 561KAP

Merkmale und Vorteile

LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film
LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561KAP adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces.
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Technische Informationen

Aushärtetechnik Aushärtung durch Wärme
Aushärtezyklus, @ 125.0 °C 2.0 h
Physikalische Form Film
Scherfestigkeit, Aluminium 1800.0 psi
Träger Polyimid