BERGQUIST® SIL PAD TSP Q2000

Known as Q-Pad® 3

Features and Benefits

Thermally conductive, fiberglass-reinforced, silicone insulator pad suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.
BERGQUIST® SIL PAD TSP Q2000 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating and air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables BERGQUIST SIL PAD TSP Q2000 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Technical Information

Carrier type Fiberglass
Color Black
Flame rating V-0
Operating temperature -60.0 - 180.0 °C
Thermal conductivity 0.2 W/mK