BERGQUIST® HI FLOW THF 1000F-AC

Known as Hi-Flow® 225F-AC

Features and Benefits

BERGQUIST HI FLOW THF 1000F-AC, Reinforced, Phase Change Thermal Interface Material
BERGQUIST® HI FLOW® THF 1000F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. BERGQUIST HI FLOW THF 1000F-AC consists of a soft, thermally conductive 55°C phase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface to improve adhesion to the heat sink.Above the 55°C phase change temperature, BERGQUIST HI FLOW THF 1000F-AC wets-out the thermal interface surfaces and flows to produce low thermal impedance. BERGQUIST HI FLOW THF 1000F-AC requires pressure from the assembly to cause material flow. The HI-FLOW coatings resist dripping in vertical orientation.The material includes a base carrier liner with differential release properties to facilitate simplicity in roll form packaging and application assembly. Please contact BERGQUIST Product Management for applications that are less than 0.07'' square.
Read More

Technical Information

Carrier film thickness 0.38 mm
Color Black
Flame rating V-0
Operating temperature 120.0 °C
Phase change temperature 55.0 °C
Standard thickness 0.102 mm
Thermal conductivity 1.0 W/mK