BERGQUIST® GAP PAD® TGP HC3000
Známé jako Gap Pad® HC 3.0
Vlastnosti a výhody
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
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Technické informace
| Barva | Modrá |
| Hodnocení hořlavosti | V-0 |
| Provozní teplota | -60.0 - 200.0 °C |
| Standardní tloušťka | 0.508 - 3.175 mm |
| Tepelná vodivost | 3.0 W/mK |
| Typ přepravce | Skleněná vlákna |
| Youngův modul, ASTM D575 | 110.0 KPa (16.0 psi ) |
BERGQUIST® GAP PAD® TGP HC3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.