LOCTITE® ABLESTIK QMI529HT-LV
Vlastnosti a výhody
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.
As the market leader and top innovator of the most advanced die attach solutions, LOCTITE® ABLESTIK® adhesives deliver superior die packaging reliability performance – and LOCTITE® ABLESTIK QMI529HT-LV is no exception. Specially designed for use in high throughput applications, this product is hydrophobic with low moisture absorption, thermally and electrically conductive, and stable at high temperatures. You can also expect great dispensing characteristics. LOCTITE® ABLESTIK QMI529HT-LV passes NASA outgassing and MIL-STD-883 standards, Method 5011.
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Technické informace
| Aplikace | Připevnění formy |
| Extrahovatelný iontový obsah, Chlorid (CI-) | 9.0 ppm |
| Extrahovatelný iontový obsah, Draslík (K+) | 9.0 ppm |
| Extrahovatelný iontový obsah, Fluorid (F-) | 9.0 ppm |
| Extrahovatelný iontový obsah, Sodík (Na+) | 9.0 ppm |
| Koeficient tepelné roztažnosti (CTE) | 62.0 ppm/°C |
| Modul v tahu, @ 250.0 °C | 738.0 N/mm² (107037.0 psi ) |
| Pevnost ve střihu RT | 20.0 kg-f |
| Pevnost ve střihu za tepla | 3.75 kg-f |
| Způsob vytvrzování | Vytvrzování teplem |
LOCTITE® ABLESTIK QMI529HT-LV
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.