As big data gets bigger and 5G technology – which will transmit data ten times faster than 4G – is set to take hold in 2020, the volume, transmission speed and processing requirements for modern communications are more demanding than ever before. The switch from wired to fiber optic connectivity between data centers and racks is stressing optical transceiver capability and increasing the heat generated by high speeds and big data volumes.

The Henkel portfolio of materials for telecom and datacom applications was designed to help boost performance by connecting key components, managing the increasing heat being generated and protecting sensitive devices in order to meet 5G demands.

Henkel Adhesive Solutions for Datacom and Telecom

Henkel Adhesive Solutions for Optical Communications

Bonding: Optical camera lens

Resources for Telecom and Datacom Infrastructure

White Paper: Reliability That Sticks

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