Henkel Adhesive Technologies

Henkel Adhesive Technologies

Storage and processors

Artificial intelligence, autonomous driving, and data centers drive increasing demand for memory, data storage, and processing power. That means GPUs, HDDs, and SDDs need thermal management and underfill materials that bolster performance, reliability, and durability.

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At a glance

$125B

By 2028

SSD revenue forecast.1

32.7%

GPU CAGR 2023-2028

GPUs growth to $172 billion by 2028.2

$2T

By 2030

Forecasted growth of artificial intelligence.3

Explore our other Consumer electronics solutions

  • Mobile devices

  • Wearable devices

  • Smart home devices

  • Cameras, sensors and modules

Storage and processor solutions

Applications such as artificial intelligence, autonomous driving, data centers, and enterprise are all fueling an insatiable demand for memory, data storage and processing power. Highly capable Henkel materials applied to enhance reliability and durability of the devices.

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Resources

Applications

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Board-level encapsulants and underfills

Electronic device reliability requires materials to protect componentry from mechanical shock, thermal impact, and other environmental factors.

Thermal management materials

Smaller, denser electronic components create heat that can degrade their performance. Component-level thermal management helps to protect electronic devices.

Solid-state drives (SSDs)

Used to store data across a variety of applications, SSDs offer faster speeds and the ability to manage large workloads without performance degradation. To do that, SSDs need effective thermal management and interconnect durability.

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Non-conductive adhesives

Non-conductive adhesives are specialized materials that bond surfaces together while preventing the flow of electricity, making them essential for applications requiring electrical insulation.

Electrically conductive adhesives

Electrically conductive adhesives are specialized materials that bond surfaces together while allowing the flow of electricity, serving as both adhesive and electrical conductor in applications requiring conductivity and adhesion.

Board-level encapsulants and underfills

Electronic device reliability requires materials to protect componentry from mechanical shock, thermal impact, and other environmental factors.

Thermal management materials

Smaller, denser electronic components create heat that can degrade their performance. Component-level thermal management helps to protect electronic devices.

Hard disk drives (HDDs)

HDDs provide critical and cost-efficient storage capacity. Materials that enhance HDD performance meet critical outgassing, functionality, and durability requirements.

Rendered graphic of a line card with multiple heatsinks inserted over a transparent background.
Board-level encapsulants and underfills

Electronic device reliability requires materials to protect componentry from mechanical shock, thermal impact, and other environmental factors.

Thermal management materials

Smaller, denser electronic components create heat that can degrade their performance. Component-level thermal management helps to protect electronic devices.

Processors

Processors like graphics cards are essential for gaming, computer-aided design, medical devices, artificial intelligence, and autonomous driving. Thermal solutions help reduce overheating risks, and durable materials boost functionality and device life.

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