LOCTITE® ABLESTIK QMI529HT-LV

Características y Ventajas

This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.
As the market leader and top innovator of the most advanced die attach solutions, LOCTITE® ABLESTIK® adhesives deliver superior die packaging reliability performance – and LOCTITE® ABLESTIK QMI529HT-LV is no exception. Specially designed for use in high throughput applications, this product is hydrophobic with low moisture absorption, thermally and electrically conductive, and stable at high temperatures. You can also expect great dispensing characteristics. LOCTITE® ABLESTIK QMI529HT-LV passes NASA outgassing and MIL-STD-883 standards, Method 5011.
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Información técnica

Aplicaciones Unión
Coeficiente de dilatación térmica (CDT) 62.0 ppm/°C
Contenido iónico extraíble, Cloruro (CI-) 9.0 ppm
Contenido iónico extraíble, Fluoruro (F-) 9.0 ppm
Contenido iónico extraíble, Potasio (K+) 9.0 ppm
Contenido iónico extraíble, Sodio (Na+) 9.0 ppm
Módulo de tracción, @ 250.0 °C 738.0 N/mm² (107037.0 psi )
Resistencia al corte a temperatura ambiente 20.0 kg-f
Resistencia al corte con calor 3.75 kg-f
Tipo de curado Curado Térmico