BERGQUIST® LIQUI FORM TLF 10000 Specially designed for the Data & Telecom Market
Features and Benefits
A one-part, red, silicone-based, fully cured thermal interface gel designed for high power industrial infrastructure electronics systems.
BERGQUIST® LIQUI FORM TLF 10000 is a thermally conductive, dispensable, highly conformable gel thermal interface material designed to meet the demanding requirements for datacom, telecom, and industrial automation applications. Its unique formulation delivers a balanced mix of high thermal conductivity, dispensing efficiency, and high reliability. This material is designed to provide efficient heat transfer between high-power electronic components and heat sinks. Recognized for its importance in optimizing electronics performance, the high thermal conductivity gel has won several industry awards. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Technical Information
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Shelf life, @ 0.0 - 35.0 °C | 180.0 day |
| Thermal conductivity | 10.0 W/mK |
BERGQUIST® LIQUI FORM TLF 10000
A one-part, red, silicone-based, fully cured thermal interface gel designed for high power industrial infrastructure electronics systems.