BERGQUIST® GAP PAD® TGP HC1000
Known as Gap Pad® HC1000
Features and Benefits
BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material
BERGQUIST® GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST GAP PAD TGP HC1000 is offered with removable protective liners on both sides of the material.
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Documents and Downloads
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Additional Documents
Technical Information
| Carrier type | Fiberglass |
| Color | Gray |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Standard thickness | 0.254 - 0.508 mm |
| Thermal conductivity | 0.1 W/mK |
| Young's modulus, ASTM D575 | 275.0 KPa (40.0 psi ) |
BERGQUIST® GAP PAD® TGP HC1000
BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material