LOCTITE® ABLESTIK 561KAP

Caractéristiques et avantages

LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film
LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561KAP adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces.
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Informations techniques

Forme physique Film
Programme de durcissement, @ 125.0 °C 2.0 hr.
Résistance au cisaillement, Aluminium 1800.0 psi
Type de polymérisation Polymérisation par la chaleur
Type porteur Polyimide