LOCTITE® 3131

Features and Benefits

LOCTITE 3131, Epoxy/Acrylate, Assembly, Dual Cure Adhesive
LOCTITE® 3131 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. The maximum performance of this material is achieved by exposure to UV light of sufficient intensity, followed by thermal cure.
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Technical Information

Cure schedule light intensity 100.0 mW/cm²
Cure schedule, @ 60.0 °C 30.0 min.
Cure schedule, @ 70.0 °C 25.0 min.
Cure schedule, @ 80.0 °C 20.0 min.
Cure type Heat cure
Number of components 1 part
Shear strength 261.0 psi
Storage temperature 2.0 - 8.0 °C
Thixotropic index 1.6
Viscosity, cone & plate Haake PK100, PK1, 2° 14000.0 mPa·s (cP)