LOCTITE® ABLESTIK 84-1LMISR4
Features and Benefits
This rigid epoxy-based die attach adhesive is a widely used for small components assembly.
As one of the most widely used die attach products in the semiconductor industry, you can rely on LOCTITE® ABLESTIK 84-1LMISR4. This electrically conductive adhesive is specially formulated for use in high throughput, automated die attach equipment. Expect minimum adhesive dispense and die put down dwell times, minimal tailing and stringing, and an up to two week work life for small series assemblies.
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Technical Information
| Application method | Dispense system |
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 40.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 150.0 ppm/°C |
| Color | Silver |
| Cure schedule, @ 175.0 °C | 1.0 hr. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 20.0 ppm |
| Extractable ionic content, Potassium (K+) | 10.0 ppm |
| Extractable ionic content, Sodium (Na+) | 10.0 ppm |
| Glass transition temperature (Tg) | 120.0 °C |
| Moisture absorption, 168 hr. @ 85°C/85% RH | 0.6 % |
| Number of components | 1 part |
| Physical form | Paste |
| Recommended for use with | LeadFrame: gold, LeadFrame: silver |
| Tensile modulus, @ 250.0 °C | 300.0 N/mm² (44000.0 psi ) |
| Thermal conductivity | 2.5 W/mK |
| Thixotropic index | 5.6 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 8000.0 mPa·s (cP) |
| Volume resistivity | ≤ 0.0002 Ohm cm |
LOCTITE® ABLESTIK 84-1LMISR4
This rigid epoxy-based die attach adhesive is a widely used for small components assembly.