BERGQUIST® GAP PAD® TGP 1000VOUS

Известен като Gap Pad® VO Ultra Soft

Характеристики и ползи

Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.
BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
Описание

Техническа информация

Модул на Юнг, ASTM D575 55.0 KPa (8.0 psi )
Работна температура -60.0 - 200.0 °C
Стандартна дебелина 0.508 - 6.35 mm
Тип носеща основа Стъклопласт
Топлопроводност 1.0 W/mK
Цвят Розов