BERGQUIST® GAP FILLER TGF 4500CVO
Features and Benefits
A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Controlled volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 4500CVO is a 4.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). The silicone-based material offers infinite thickness variation without causing additional stress to components, and the formula ensures optimal viscosity for efficient automated dispensing processes. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Technical Information
Cure type | Heat cure, Room temperature (ambient) cure |
Operating temperature | -60.0 - 200.0 °C |
Shelf life, @ 25.0 °C | 180.0 day |
Thermal conductivity | 4.5 W/mK |