Potting materials are a permanent protective solution which will remain as an integral part of the unit to protect the electronic assembly while providing numerous benefits:    

  • Electrical Insulation 
  • Enhanced Mechanical Strength 
  • Heat dissipation
  • Vibration/shock resistance
  • Corrosion protection
  • Chemical protection
  • Environmental influences

Ultimate Protection

Potting and encapsulation systems from Henkel offer superb printed circuit boards and electrical device protection. Used in today’s most challenging environments such as automotive and aerospace where thermal conductivity and operating temperature boundaries are pushed to the limit, potting materials deliver enhanced mechanical strength, provide electrical insulation and improve thermal reliability.

Further Areas of Use with Sonderhoff Potting Materials

Electronics Potting

Potting masses protect the sensitive electrical and electronic parts of devices from variable operating conditions, such as temperature fluctuations, damp, vibrations and more. For more information on Sonderhoff Potting, click here

Plug and Cable Potting

Even the tiniest gaps in plug housings, connectors and power supply units  can be filled by potting masses. Potting materials for plugs and cables are flexible, highly water resistant, mechanically stable and tear-resistant. For more information on Sonderhoff Potting, click here.

Photovoltaic Potting

Photovoltaic potting makes devices extremely weather-resistant, protects electrics against atmospheric fluctuations and the infiltration of damp. For more information on Sonderhoff Potting, click here

LED Potting


Transparent or opaque potting systems protect LEDs from water, dust and other atmospheric influences, enabling effective encapsulation as well as optimal light scattering for spot light. Additionally, the Sonderhoff mixing and dosing system for potting avoids air bubbles and smears making optimal protection possible. For more information on Sonderhoff Potting, click here.



Filter Potting

Potting compounds are used to join end-caps of various kinds of filters, as well as for gluing and sealing filters to the filter frame. This provides a leakage-free sealing of the frames and allows for the filtering of clean air. Foamed potting for bonding the filter medium into the filter frame enables cost and weight reductions, also meeting the high quality requirements. Due to the foamed cell structure, the amount of adhesive per filter can be reduced by up to 50 percent. The lower density results in less weight that facilitates easier part handling. For more information on Sonderhoff Potting, click here.

Liquid Potting Materials

Performance Comparison of Silicones, Urethanes and Epoxys in Flexibility and Mechanical Strength

Comparison of Temperature Resistance of Silicones, Urethanes and Epoxys

4 Major Constituents of Potting Material – 1 K and 2 K Potting

One - Component (1K) Potting: 1K potting materials are a mixture of four constituents. The main constituents, Resin and Hardener, are already mixed together with no additional mixing required. 1K potting materials are therefore ready for use.  

The four constituents and their functions are as follows:

  • Resin – A natural or synthetic compound that hardens with treatment. The compound is classified in a number of different ways, depending on its exact chemical composition and potential uses.
  • Hardener – This substance (or mixture) is required for the polymerization reaction with the resin. During this chemical reaction, the hardener is consumed and becomes fully part of the polymer backbone. 
  • Filler – Often inert, the filler is added to a resin/hardener mixture to establish desired  properties such as thermoshock resistance, CTE density, dielectric properties etc.
  • Additives – Multiple types of additives with various functions can be used depending on the objectives. An additive can be a (reactive) diluent, anti-foam agent, adhesion promoter, pigments, etc.
     

Two - Component (2K) Potting: Like 1K materials, 2K potting materials also consist of four constituents, but the hardener (or its mixture) is physically separated from the resin. This separation prohibits reaction prior to mixing.  With 2K products, the constituents must be weighed and mixed and the polymerization reaction starts after mixing. In 2K potting materials, just as in 1K potting materials, various fillers and additives can be part of the formulation to achieve the required properties and performance of the cured material. 

Potting Selection Guide

Determine in a few steps Henkel's potting solution for your application and gain access to more technical details and downloads.

Related Pages

Resources for Potting Compounds

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