Potting Compounds for the Ultimate Protection of Electronics
Potting compounds for effective potting of electronics to protect against environmental influences, improve mechanical strength & high electrical insulation.
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Potting materials are a permanent protective solution which will remain as an integral part of the unit to protect the electronic assembly while providing numerous benefits:
Potting and encapsulation systems from Henkel offer superb printed circuit boards and electrical device protection. Used in today’s most challenging environments such as automotive and aerospace where thermal conductivity and operating temperature boundaries are pushed to the limit, potting materials deliver enhanced mechanical strength, provide electrical insulation and improve thermal reliability.
One - Component (1K) Potting: 1K potting materials are a mixture of four constituents. The main constituents, Resin and Hardener, are already mixed together with no additional mixing required. 1K potting materials are therefore ready for use.
The four constituents and their functions are as follows:
Two - Component (2K) Potting: Like 1K materials, 2K potting materials also consist of four constituents, but the hardener (or its mixture) is physically separated from the resin. This separation prohibits reaction prior to mixing. With 2K products, the constituents must be weighed and mixed and the polymerization reaction starts after mixing. In 2K potting materials, just as in 1K potting materials, various fillers and additives can be part of the formulation to achieve the required properties and performance of the cured material.
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