LOCTITE® ABLESTIK 8387B
Features and Benefits
LOCTITE ABLESTIK 8387B, Epoxy, Die Attach, Non-Conductive Adhesive
LOCTITE® ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC. Please refer to the TDS for alternate cure schedules.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Application method | Dispense system |
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 94.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 165.0 ppm/°C |
| Colour | Black |
| Cure schedule, @ 150.0 °C | 2.0 min. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 299.0 ppm |
| Extractable ionic content, Potassium (K+) | 4.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Glass transition temperature (Tg) | 96.0 °C |
| Hot die shear strength, @ 250.0 °C 12.7 x 12.7 mm Si die on Cu LF | 270.0 kg-f |
| Key characteristics | Conductivity: electrically non-conductive, Cure speed: fast cure |
| Number of components | 1 part |
| Physical form | Paste |
| RT die shear strength, 3 x 3 mm Si die on Cu LF @ 25°C | 4400.0 psi |
| Recommended for use with | Laminate, LeadFrame: silver |
| Tensile modulus, DMTA @ 250.0 °C | 53.0 N/mm² (7700.0 psi ) |
| Thixotropic index | 4.5 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9500.0 mPa·s (cP) |
LOCTITE® ABLESTIK 8387B
LOCTITE ABLESTIK 8387B, Epoxy, Die Attach, Non-Conductive Adhesive