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Thermal Management Materials
To address the thermal demands of today’s electronic devices, Henkel has developed a complete portfolio of high-performance, user-friendly products. Effective control of heat is an increasing concern among today’s electronic device manufacturers and, as products become smaller, the need to dissipate damaging heat effectively will be greater than ever.
Of course, each application is unique and its requirements specific, which is why Henkel has formulated a comprehensive range of thermal management materials to suit a variety of current and future heat control needs.
Under the banner of the well-respected LOCTITE® brand, Henkel’s thermal management materials include:
As consumer demand and product capability continue to drive greater function within ever-decreasing footprints, effectively controlling the thermal load will be critical to ensuring long product life cycles and expected reliability. That’s why today’s electronics manufacturers are increasingly turning to Henkel for trusted, proven thermal management solutions.
When there is a requirement for bonding large areas or complex parts together, thermal adhesive films are the preferred materials. Larger bonding areas are problematic for pastes and other liquid-based mediums, as voids may result; films, however, deliver uniform, void-free bondlines and controlled thicknesses. Supplied in custom, pre-cut formats, Henkel’s line of thermal adhesive films offers a clean, waste-free, easily processed solution with a low total cost of ownership in thermally and electrically conductive formulas.
Henkel’s adhesive pastes provide robust mechanical attachment, allowing for the elimination of fasteners such as screws and clips, which also helps reduce device size and weight to align with the trend toward electronics miniaturization. With the ability to maintain thin bondlines and excellent thermal paths, LOCTITE® brand adhesive pastes provide superb thermal management.
The broad portfolio of pastes is available with shimming for controlled bondlines and optimized adhesive performance, or in non-shimming formulas for optimized thermal performance. To accommodate various manufacturing requirements, thermal or room-temperature cure mechanisms are offered. Like all Henkel thermal materials, the complete line of adhesive pastes is RoHS compliant.
Phase Change Materials
Ideal for high-performance solid-state devices such as CPUs, GPUs, IGBTs and discrete components, LOCTITE® phase-change films deliver on-demand performance with none of the drawbacks of traditional greases. These materials are solid at room temperature, but melt and flow during device operation to provide a thin bondline and high reliability without the “pump-out” often experienced with some thermal greases. The need for effective heat dissipation is critical for power modules. Henkel’s LOCTITE® TCP thermal interface material is incorporated at the design phase to ensure reliable performance over the long term and significantly reduces contact resistance between the metal area on the power semiconductor and heat sink. The material can be screen printed to control for specific patterns and thicknesses to accommodate specific applications.
Thermal Absorbent Films
Henkel’s LOCTITE® TAF series product line consists of market-first thermal absorbent film materials that effectively absorb, spread, insulate and conduct IC-generated heat that is often the cause of high skin temperature in consumer handheld devices. Not only do the materials absorb thermal energy, they also have insulation and controlled directional thermal conductivity to reduce skin temperature. With unique properties that enable the material to be dynamic, LOCTITE® TAF series films regulate heat and the inherent temperature rise and fall of CPU processing. Contourability and application-specific thicknesses make the LOCTITE® TAF series of thermal absorbent films ideal for high-density, space- limited applications.
For manufacturers with a preference for traditional thermal greases, Henkel has several RoHS-compliant formulations. Used in high-performance applications where minimal bondline thickness is essential for high thermal performance, greases offer immediate functionality upon application. In addition, greases have a tendency to compensate for voids easily, so they are a particularly viable solution for devices that have flatness or coplanarity issues. Available in cartridges or bulk containers, Henkel’s thermal greases include high- performance, high-temperature reliability, silicone-free and water-cleanable formulas.
Thermal Gap Pads
Henkel’s latest innovation, thermal gap pads, is a solution for mechanical offset applications found in almost every electronic device. Designed in a range of thicknesses and thermal conductivity capabilities, LOCTITE® thermal gap pads have been developed to address specific heat processing needs. The LOCTITE® TFX product line, for example, is designed to provide a high level of compliance or softness and is available in thermal conductivity performance that ranges from 1 to 3.3 W/mK. All Henkel thermal gap pads comply with RoHS and are available in 200 mm x 300 mm sheets with a range of thicknesses from 0.3 mm to 5.5 mm. Customers may also select specific die-cut pads directly from Henkel or from Henkel distribution partners.
Thermal Management Materials: Additional Resources
Absorbing the Heat for Cooler,
Better Performing Handhelds
Thermal Absorbent Film View Video