TECHNOMELT

Low Pressure Adhesive Molding Workshop

A New Way to Package & Encapsulate Electronics, Cabling & Other Related Assemblies or Devices

Presented by Henkel Electronics Materials, LLC with Moldman Machines, LLC
Hosted by REStronics, Robert McKeown & Henkel


Workshop Information:
As electronics devices continue their dramatic move toward finer pitches and more fragile components with reduced dimensions, manufacturing processes for these parts have become more complex and often more costly. This has proven true especially when using traditional encapsulant and molding techniques. Recently, however, a low pressure molding material and process were introduced. Learn how to dramatically reduce costs, provide a simple one-step molding alternative and deliver measurable improvements in manufacturing efficient.
Presentation accompanied by hands-on Low Pressure Molding demonstration.

Workshop Details Tuesday, December 10, 2013 Tuesday, December 10, 2013 Thursday, December 12, 2013
Hosts Robert McKeown Company, Inc. & REStronics Robert McKeown Company, Inc. & REStronics REStronics & Henkel
Presentation 9:00am - 10:30am 1:00pm - 2:30pm 1:00pm - 2:30pm 
Demonstration 10:30am - 11:30am 2:30pm - 3:30pm 2:30pm - 3:30pm
Q&A Session 11:30am - 12:00pm 3:30pm - 4:00pm 3:30pm - 4:00pm
Location Robert McKeown Company, Inc.
111 Chambers Brook Rd.
Branchburg, NJ
08876
Robert McKeown Company, Inc.
111 Chambers Brook Rd.
Branchburg, NJ
08876 
Radisson Hotel
Rochester Airport
175 Jefferson Rd.
Rochester, NY
14623-2138



3 Sessions Available

RSVP with Marie Corrigan | mcorrigan@restronics.com or 732.617.6990

Featured Speakers:
Kurt Carlson and Reimer Hansen founded the Cavist Corporation in 1998. Cavist and Henkel established a working relationship from the very beginning. Kurt has been working with mold-set design, equipment design and TECHNOMELT for over 13 years.

Michael J. Pierce is the Mid-Atlantic sales representative for Henkel Electronic Materials LLC the world leader in adhesive technologies. Michael's 17 year career has encompassed every aspect of this technology including product development, technical service and market research.