TECHNOMELT Low Pressure Molding Solutions

Henkel’s renowned TECHNOMELT low pressure molding solution is delivering superior sealing adhesion and excellent temperature and solvent resistance. The simplicity of these materials is their advantage: because the entire TECHNOMELT operation takes place at low pressure, cycle time is short and fine or fragile circuitry is not damaged, delivering measurable improvements over that of traditional potting or encapsulating processes. PCB and circuitry protection is essential in modern, challenging applications, and Henkel delivers manufacturers proven, reliable solutions and peace of mind.


• Additive design allows for alternative solutions (simplified process vs. traditional technologies)
• “Sky Lining” allows use of less material, precise encapsulation and less weight
• Functional design removes process steps
• Improved look and image

• Reduces total cost of ownership (TCOO)
• Increased throughput
• Low capital equipment costs and reduced footprint
• Low viscosity materials allow for low injection pressures

• Adhesion to multiple surfaces
• Complete watertight encapsulation
• Safe, 1-component, UL 94-V0 approved
• High temperature resistance
• Compliant materials suitable for sensitive electronic components
• Less handling and shorter process
• No cure process required

• Zero waste
• All excess material and scrap are recyclable
• Natural ingredients

NEW TECHNOMELT Product Highlights

NEW UV-Stabilized White and Chemical-Resistant TECHNOMELT Low Pressure Molding Materials
  • Excellent UV stability
  • Excellent thermal stability
  • Low melt viscosity
  • Good flexibility at low temperature
  • UL-94V0 approved
  • View Product Fact Sheet

Technomelt Low Pressure Molding Solutions: Additional Resources

Henkel Expands Award-Winning TECHNOMELT Portfolio

Low Pressure Molding Materials Now Available in UV-Stabilized White, Clear and Chemical-Resistant Formulas

TECHNOMELT Adhesive Solutions

TECHNOMELT products are a good choice as they offer shorter cycle time, ease in processing, part and process simplification and, most importantly, they are are environmentally friendly.

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