Semicon West 2013

Be Henkel’s guest at this year’s Semicon West, taking place July 9 -11 at San Francisco’s Moscone Center, and find out why we continue to earn the business of today’s top semiconductor firms. With top materials technologies that are enabling new package designs with superior performance, Henkel continues to lead the industry in innovative packaging solutions.

Stop by Booth #5961 and learn more about Henkel’s latest material technologies, such as:

  • The industry’s first conductive die attach film technology, LOCTITE ABLESTIK CDF 200P and LOCTITE ABLESTIK CDF 800
  • Proven, off-the-shelf MEMS materials for fast time to market
  • Next-generation silver sintering material, LOCTITE ABLESTIK SSP 2020, for pressure or pressureless processes that enable high power applications and offer performance equivalent to or better than solder
  • Innovative mold compounds for power devices, IC’s and passive and discretes

Henkel understands that package requirements vary, that every process is unique and that today’s most advanced semiconductor innovations need a materials partner that can bring new package ideas into reality. Visit us at Semicon West and discover the Henkel difference.