Semiconductor Assembly (Markets)

Today’s consumers want smaller devices, more functionality, outstanding reliability and, of course, lower cost. When it comes to semiconductor packaging, it’s possible to have it all with materials solutions from Henkel. As a pioneer in the semiconductor packaging market, Henkel has successfully enabled many of today’s leading consumer products. 


Meeting the demands of consumers and packaging specialists

Discrete Components Passive Components QFP

QFN SOIC / SOP BGA / CSP

Smart Card DRAM

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