Visit Henkel at Semicon West and Learn How Our Latest Materials are Delivering a Competitive Advantage for Next-Generation Devices
From booth #5747 in the North Hall, Henkel will display a full range of new materials – all designed to deliver a performance edge and competitive advantage for wirebond, flip-chip and MEMS applications. Be our guest, talk to our technical team and learn more about:
• Wirebond Packaging — Thinner die and diminishing dimensions are challenging traditional wirebond devices. Leveraging Henkel’s advanced die attach and mold compound materials ensures high performance, reduced footprints and greater functionality.
o Die Attach Pastes for Higher Power IC packaging
o Die Attach Pastes for High Brightness and High Power LEDs
o Conductive Die Attach Films
o Non-conductive Die Attach Films
o RoHS-Compliant, Halogen-Free Mold Compounds
• Flip-Chip Packaging – Newer copper (Cu) pillar and traditional gold bump flip-chip devices are pushing I/O counts to new levels, making device protection more challenging. Henkel’s novel pre-applied and capillary underfill materials are delivering the solution.
o Non-conductive paste underfills for streamlined Cu Pillar flip-chip processing
o Capillary underfills for high UPH flip chip processes
• MEMS – Market-ready, proven materials solutions for MEMS production mean faster product commercialization and better profitability.
• EMI Shielding – Eliminate bulky cans and lids with new conductive coating and paste materials for small form factor EMI shielding.
All of these innovative Henkel materials — and more — will be showcased at Semicon West, Booth # 5747 in the North Hall.