Though most QFP structures are similar, Die Attach material requirements fro this type of package may vary based on the leadframe finish or Integrated Chip (IC) size. QFN device size may also dictate the use of different Die Attach formulations and Molding Compounds.

Quad Flat Pack (QFP) devices are leadframe-type packages in which leads protrude from the Molding Compound from all four sides.