Gap Pad EMI 1.0

Gap Pad EMI 1.0 is a highly conformable, combination gap filling material offering both thermal conductivity performance and Electromagnetic Energy absorption (cavity resonances and/or cross-talk causing Electromagnetic Interference) at frequencies of 1GHz and higher. The material offers EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress. The soft nature of the material enhances wet-out at the interface resulting in better thermal performance than harder materials with a similar performance rating. Gap Pad EMI 1.0 has an inherent, natural tack on one side of the material eliminating the need for thermally-impeding adhesive layers and allowing improved handling during placement and assembly. The other side is tack-free, again enhancing handling and rework, if required. Gap Pad EMI 1.0 is supplied with a protective liner on the material’s tacky side.

Your Benefits

  • Thermal Conductivity: 1.0 W/m-K
  • Electromagnetic Interference (EMI) absorbing
  • Highly conformable, low hardness
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Electrically isolating


  • Consumer electronics
  • ASICs and DSPs
  • Telecommunications
  • PC applications
Gap Pad EMI 1.0 Downloads

RoHS Certificate
Application Note 116

Applications Thermal Pads