Bond-Ply 400

Bergquist Bond-Ply 400 is an un-reinforced, thermally conductive, pressure sensitive adhesive tape. The tape is supplied with protective topside tabs and a carrier liner. Bond-Ply 400 is designed to attain high bond strength to a variety of “low energy” surfaces, including many plastics, while maintaining high bond strength with long term exposure to heat and high humidity.


Your benefits

  • Thermal impedance: 0.87°C-in²/W (@50 psi)
  • Easy Application
  • Eliminates need for external hardware (screws, clips, etc.)
  • Available with easy release tabs

Applications

Secure:

  • Heat sink onto BGA graphic processor
  • Heat sink to computer processor 
  • Heat sink onto drive processor
  • Heat spreader onto power converter PCB
  • Heat spreader onto motor control PCB
Bond-Ply 400 Downloads

Selection Guide
RoHS Certificate
Halogen Testing Report
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