Bond-Ply LMS-HD

Bond-Ply® LMS-HD is a thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double lined with protective films. The low modulus silicone design effectively absorbs mechanical stresses induced by assembly-level CTE mismatch, shock and vibration while providing exceptional thermal performance (vs PSA technologies) and long-term integrity. Bond-Ply® LMS-HD will typically be used for structurally adhering power components and PCBs to a heat sink.

Your Benefits

  • TO-220 Thermal performances: 2.3°C/W, initial pressure only lamination
  • Exceptional dielectric strength
  • Very low interfacial resistance
  • Continuous use of -60 to 180°C
  • Eliminates mechanical fasteners


  • Discrete semi-conductor packages bonded to heat spreader or heat sink
Bond-Ply LMS-HD Downloads

Halogen Testing Report
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